Flexible display window and electronic device having the same

ABSTRACT

A flexible display window and an electronic device having the same are provided. The electronic device includes a housing including a first rigid portion and a flexible portion, at least one outer layer that covers the first rigid portion and the flexible portion, a display device including a screen including a first portion exposed through the first rigid portion and a second portion extended from the first portion and exposed through the flexible portion, at least one processor electrically coupled to the display device, and a memory electrically coupled to the at least one processor, wherein the outer layer includes a polymer layer, a glass layer interposed between the polymer layer and the screen, and an adhesive layer interposed between the polymer layer and the glass layer.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit under 35 U.S.C. § 119(e) of a U.S.Provisional application filed on Jan. 6, 2016 in the U.S. Patent andTrademark Office and assigned Ser. No. 62/275,729, and under 35 U.S.C. §119(a) of a Korean patent application filed on May 2, 2016 in the KoreanIntellectual Property Office and assigned Serial number 10-2016-0054196,the entire disclosure of each of which is hereby incorporated byreference.

TECHNICAL FIELD

The present disclosure relates to a flexible display window and anelectronic device having the same.

BACKGROUND

In general, for protection of a display located at a front surface, sidesurface, or rear surface or for a design, a transparent material (e.g.,glass, polymer material (e.g., transparent resin material, transparentsheet material)) is applied to an electronic device. As the transparentmaterial, glass is most widely used due to surface hardness andexcellent optical performance.

Nowadays, interest in an electronic device including a flexible displaymodule that may be bent (hereinafter, a flexible electronic device) hasincreased.

However, when applying a transparent material of a glass material to afront surface or a rear surface, the flexible electronic device has manyproblems. For example, the glass material has a low bending ability, andwhen forming the glass material of a thin thickness for a bendingability, the glass material may be easily broken. Further, because theglass material is weak when exposed to heat and/or moisture, it isdifficult to implement a heterogeneous complex material by synthesizingthe glass material with another material.

The polymer material is generally weak on surface hardness and scratchresistance, and when a flexible display module is located at a rearsurface, there is a problem that the flexible display module is weakagainst pressing and stabbing. Further, because sensory sensitivity ofthe polymer material is deteriorated due to weak bending rigidity, thereis a problem that a quality thereof is deteriorated.

The above information is presented as background information only toassist with an understanding of the present disclosure. No determinationhas been made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the present disclosure.

SUMMARY

Aspects of the present disclosure are to address at least theabove-mentioned problems and/or disadvantages and to provide at leastthe advantages described below. Accordingly, an aspect of the presentdisclosure is to provide a flexible display window and an electronicdevice having the same that simultaneously have characteristics of aglass material and a polymer material and that can apply to a flexibleelectronic device.

In accordance with an aspect of the present disclosure, an electronicdevice is provided. The electronic device includes a housing including afirst rigid portion and a flexible portion, at least one outer layerthat covers the first rigid portion and the flexible portion, a displaydevice including a screen including a first portion exposed through thefirst rigid portion and a second portion extended from the first portionand exposed through the flexible portion, at least one processorelectrically coupled to the display device, and a memory electricallycoupled to the at least one processor, wherein the outer layer includesa polymer layer, a glass layer interposed between the polymer layer andthe screen, and an adhesive layer interposed between the polymer layerand the glass layer.

In accordance with another aspect of the present disclosure, anelectronic device is provided. The electronic device includes a housingincluding a first rigid portion, a second rigid portion, and a bendableportion connected between the first rigid portion and the second rigidportion and that may be completely bent such that at least a portion ofthe first rigid portion and the second rigid portion face each other, atleast one outer layer that covers the first rigid portion, the secondrigid portion, and the bendable portion, a display device including atouch screen including a first portion exposed through the first rigidportion, a second portion exposed through the second rigid portion, anda third portion exposed through the bendable portion, wherein the firstportion is extended from one side of the third portion, and wherein thesecond portion is extended from the other side of the third portion, atleast one processor electrically coupled to the display device, and amemory electrically coupled to the at least one processor, wherein theouter layer includes a polymer layer, and a glass layer interposedbetween the polymer layer and the touch screen and disposed over thefirst portion, the second portion, and the third portion of the touchscreen.

In accordance with another aspect of the present disclosure, a flexibledisplay window is provided. The flexible display window includes apolymer layer of a flexible and transparent material, a flexible glasslayer, and an adhesive layer disposed between the polymer layer and theglass layer and that bonds the polymer layer and the glass layer.

As described above, according to various embodiments of the presentdisclosure, by improving impact resistance, strength, and bendingrigidity of a flexible display window, a quality thereof can beimproved. Further, according to various embodiments of the presentdisclosure, a flexible display window having high surface hardness(e.g., 2 hardness (H) or more) and scratch resistance can be provided.Further, according to various embodiments of the present disclosure, athickness of a flexible display window can be reduced. Further, aflexible display window according to various embodiments of the presentdisclosure can be bent to 3 radius (R) (curved surface of a circlehaving a radius of 3 mm) or less. Thereby, a flexible display windowaccording to various embodiments of the present disclosure can beapplied to a foldable or flexible electronic device. Further, accordingto various embodiments of the present disclosure, a flexible displaywindow having the same optical performance as that of a glass materialcan be provided. Further, according to various embodiments of thepresent disclosure, a flexible display window can be easily replaced.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the present disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of certainembodiments of the present disclosure will be more apparent from thefollowing description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a diagram illustrating an electronic device according to anembodiment of the present disclosure;

FIG. 2 is a diagram illustrating a structure of an outer layer accordingto an embodiment of the present disclosure;

FIG. 3 is a diagram illustrating prevention of damage of an outer layerby an impact according to an embodiment of the present disclosure;

FIG. 4A is a diagram illustrating a coupling structure of a window in anelectronic device according to the related art;

FIG. 4B is a diagram illustrating an example of a coupling structure ofan outer layer according to an embodiment of the present disclosure;

FIG. 5 is a diagram illustrating another example of a coupling structureof an outer layer according to an embodiment of the present disclosure;

FIG. 6 is a cross-sectional view illustrating an internal structure ofan electronic device when being bent according to an embodiment of thepresent disclosure;

FIG. 7 is a diagram illustrating a structure of an adhesive layer of anelectronic device according to an embodiment of the present disclosure;and

FIG. 8 is a block diagram illustrating a configuration of an electronicdevice according to various embodiments of the present disclosure

Throughout the drawings, it should be noted that like reference numbersare used to depict the same or similar elements, features, andstructures.

DETAILED DESCRIPTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the present disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thepresent disclosure. In addition, descriptions of well-known functionsand constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of the presentdisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of the presentdisclosure is provided for illustration purpose only and not for thepurpose of limiting the present disclosure as defined by the appendedclaims and their equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

The terms “A or B,” “at least one of A or/and B,” or “one or more of Aor/and B” as used herein include all possible combinations of itemsenumerated with them. For example, “A or B,” “at least one of A and B,”or “at least one of A or B” means (1) including at least one A, (2)including at least one B, or (3) including both at least one A and atleast one B.

The terms such as “first” and “second” as used herein may modify variouselements regardless of an order and/or importance of the correspondingelements, and do not limit the corresponding elements. These terms maybe used for the purpose of distinguishing one element from anotherelement. For example, a first user device and a second user device mayindicate different user devices regardless of the order or importance.For example, a first element may be referred to as a second elementwithout departing from the scope the present disclosure, and similarly,a second element may be referred to as a first element.

It will be understood that, when an element (for example, a firstelement) is “(operatively or communicatively) coupled with/to” or“connected to” another element (for example, a second element), theelement may be directly coupled with/to another element, and there maybe an intervening element (for example, a third element) between theelement and another element. To the contrary, it will be understoodthat, when an element (for example, a first element) is “directlycoupled with/to” or “directly connected to” another element (forexample, a second element), there is no intervening element (forexample, a third element) between the element and another element.

The expression “configured to (or set to)” as used herein may be usedinterchangeably with “suitable for,” “having the capacity to,” “designedto,” “adapted to,” “made to,” or “capable of” according to a context.The term “configured to (set to)” does not necessarily mean“specifically designed to” in a hardware level. Instead, the expression“apparatus configured to . . . ” may mean that the apparatus is “capableof . . . ” along with other devices or parts in a certain context. Forexample, “a processor configured to (set to) perform A, B, and C” maymean a dedicated processor (e.g., an embedded processor) for performinga corresponding operation, or a generic-purpose processor (e.g., acentral processing unit (CPU) or an application processor (AP)) capableof performing a corresponding operation by executing one or moresoftware programs stored in a memory device.

Electronic devices according to various embodiments of the presentdisclosure may include at least one of, for example, smart phones,tablet personal computers (PCs), mobile phones, video telephones,electronic book readers, desktop PCs, laptop PCs, netbook computers,workstations, servers, personal digital assistants (PDAs), portablemultimedia players (PMPs), Motion Picture Experts Group phase 1 or phase2 (MPEG-1 or MPEG-2) audio layer 3 (MP3) players, mobile medicaldevices, cameras, or wearable devices. According to an embodiment of thepresent disclosure, the wearable devices may include at least one ofaccessory-type wearable devices (e.g., watches, rings, bracelets,anklets, necklaces, glasses, contact lenses, or head-mounted-devices(HMDs)), fabric or clothing integral wearable devices (e.g., electronicclothes), body-mounted wearable devices (e.g., skin pads or tattoos), orimplantable wearable devices (e.g., implantable circuits).

The electronic devices may be smart home appliances. The smart homeappliances may include at least one of, for example, televisions (TVs),digital versatile disc (DVD) players, audios, refrigerators, airconditioners, cleaners, ovens, microwave ovens, washing machines, aircleaners, set-top boxes, home automation control panels, securitycontrol panels, TV boxes (e.g., Samsung HomeSync™, Apple TV™, or GoogleTV™), game consoles (e.g., Xbox™ and PlayStation™), electronicdictionaries, electronic keys, camcorders, or electronic picture frames.

The electronic devices may include at least one of various medicaldevices (e.g., various portable medical measurement devices (such asblood glucose meters, heart rate monitors, blood pressure monitors, orthermometers, and the like), a magnetic resonance angiography (MRA)device, a magnetic resonance imaging (MRI) device, a computed tomography(CT) device, scanners, or ultrasonic devices, and the like), navigationdevices, global positioning system (GPS) receivers, event data recorders(EDRs), flight data recorders (FDRs), vehicle infotainment devices,electronic equipment for vessels (e.g., navigation systems,gyrocompasses, and the like), avionics, security devices, head units forvehicles, industrial or home robots, automatic teller machines (ATMs),points of sales (POSs) devices, or Internet of things (IoT) devices(e.g., light bulbs, various sensors, electric or gas meters, sprinklerdevices, fire alarms, thermostats, street lamps, toasters, exerciseequipment, hot water tanks, heaters, boilers, and the like).

The electronic devices may further include at least one of parts offurniture or buildings/structures, electronic boards, electronicsignature receiving devices, projectors, or various measuringinstruments (such as water meters, electricity meters, gas meters, orwave meters, and the like). The electronic devices may be one or morecombinations of the above-mentioned devices. The electronic devices maybe flexible electronic devices. Also, the electronic devices are notlimited to the above-mentioned devices, and may include new electronicdevices according to the development of new technologies.

Hereinafter, the electronic devices according to various embodiments ofthe present disclosure will be described with reference to theaccompanying drawings. The term “user” as used herein may refer to aperson who uses an electronic device or may refer to a device (e.g., anartificial intelligence electronic device) which uses an electronicdevice.

FIG. 1 is a diagram illustrating an electronic device according to anembodiment of the present disclosure.

Referring to FIG. 1, an electronic device 100 according to the presentembodiment may be a foldable electronic device that may be folded in atleast one location. However, the present disclosure is not limitedthereto. For example, the electronic device 100 according to the presentembodiment may be a flexible electronic device.

A drawing of a reference numeral 110 of FIG. 1 illustrates a foldedshape of the electronic device 100, and a drawing of a reference numeral120 illustrates a cross-sectional view of the electronic device 100taken along line A-A′. Further, a drawing of a reference numeral 130 ofFIG. 1 illustrates an extended shape of the electronic device 100, and adrawing of a reference numeral 140 illustrates a cross-sectional view ofthe electronic device 100 taken along line B-B′.

With reference to the drawings of the reference numerals 110 and 130,the electronic device 100 may include a speaker 111, front camera 112,rear camera 113, and function keys 114. The function keys 114 mayinclude a home key, cancel key, menu key. The function keys 114 may beformed with a physical button key, touch key, soft key, or a combinationthereof According to an embodiment, the electronic device 100 mayfurther include an illumination sensor, volume key, and power key.

With reference to the drawings of the reference numerals 120 and 140,the electronic device 100 according to the present embodiment mayinclude a housing 10, display device 20, and outer layer 30.

The housing 10 is a case that forms an external appearance of theelectronic device 100. The housing 10 may be formed with a first rigidportion 11, second rigid portion 12, and flexible portion 13.

The first rigid portion 11 and the second rigid portion 12 are not bentand may be made of a hard material (e.g., an injection material or ametal material (e.g., aluminum)).

The flexible portion 13 is located between the first rigid portion 11and the second rigid portion 12 to enable the electronic device 100 tobe bent. For example, the flexible portion 13 may be completely bentsuch that the first rigid portion 11 and the second rigid portion 12face, as shown in the drawing of the reference numeral 120. For example,the flexible portion 13 may be formed with a multi joint hinge. Theflexible portion 13 may be referred to as a bendable portion.

The display device 20 may display various screens for operation of theelectronic device 100. The display device 20 may be bent. For example,the display device 20 may be bent as shown in the drawing of thereference numeral 120 or may be extended as shown in the drawing of thereference numeral 140. The display device 20 may include a first portion21 exposed through the first rigid portion 11, a second portion 22extended from the first portion 21 and exposed through the flexibleportion 13, and a third portion 23 extended from the second portion 22and exposed through the second rigid portion 12. According to anembodiment, the first portion 21 of the display device 20 may be locatedon the first rigid portion 11, the second portion 22 may be located onthe flexible portion 13, and the third portion 23 may be located on thesecond rigid portion 12.

The display device 20 may be completely folded such that the firstportion 21 and the third portion 23 are located at opposite sides, asshown in the drawing of the reference numeral 120. Alternatively,according to an embodiment, in the display device 20, the first portion21 and the third portion 23 may be completely bent to face each other.

The display device 20 may be a touch screen. The touch screen mayinclude at least one capacitive element and a sensing circuit thatdetects a pressure and/or a touch input occurring on a screen of thedisplay device using the capacitive element.

The outer layer 30 may cover the first rigid portion 11 and the flexibleportion 13. According to an embodiment, the outer layer 30 may cover atleast a display device 20. According to an embodiment, the outer layer30 may cover a rear surface or a side surface of the electronic device100.

The outer layer 30 may be made of a transparent material. For example,the outer layer 30 may be formed by adhering a polymer sheet (polymerlayer) and a glass sheet (glass layer). A detailed description of theouter layer 30 will be descried later with reference to FIG. 2.

The electronic device 100 of FIG. 1 is an example, and the presentdisclosure is not limited thereto. For example, FIG. 1 illustrates thatthe electronic device 100 is folded using a vertical direction as ashaft at an intermediate point of a horizontal direction, but theelectronic device 100 may be folded at a plurality of locations (e.g.,at ¼ point and ¾ point of a horizontal direction). Further, according toan embodiment, the electronic device 100 may be folded using ahorizontal direction as a shaft in at least one point of a verticaldirection.

FIG. 2 is a diagram illustrating a structure of an outer layer accordingto an embodiment of the present disclosure, and FIG. 3 is a diagramillustrating prevention of damage of an outer layer by an impactaccording to an embodiment of the present disclosure.

Referring to FIGS. 2 and 3, the outer layer 30 according to the presentembodiment may include an anti-fingerprint layer 31, anti-scratch layer32, anti-reflective layer 33, polymer layer 34, adhesive layer 35, andglass layer 36.

The anti-fingerprint layer 31 can prevent a stain such as a userfingerprint from being stained on a surface of the anti-scratch layer32. The anti-fingerprint layer 31 may be formed by coating a compoundfor preventing a fingerprint from being stained.

The anti-scratch layer 32 can prevent scratch from occurring on thepolymer layer 34. For this reason, the anti-scratch layer 32 may havesurface hardness of 2H (on the coating hardness scale) or more and havebending rigidity of a glass level. For example, even if the anti-scratchlayer 32 is bent to 3 radius (R) or less in which the electronic device100 may be bent in a complete circle, the anti-scratch layer 32 may haveflexibility in which a crack does not occur. Thereby, the outer layer 30according to the present embodiment can secure (provide) a qualitysimilar to that of glass. The anti-scratch layer 32 may be formed bycoating a compound at an upper surface of the polymer layer 34.

The anti-reflective layer 33 can prevent light reflection by the outerlayer 30 or the display device 20. The anti-reflective layer 33 may beformed by coating a compound that suppresses light reflection at anupper surface of the polymer layer 34.

The polymer layer 34 may be a film sheet of a thin film of a polymerorganic material. The polymer layer 34 according to the presentembodiment may have a thickness between 0.025 to 0.2 thickness (T) mmFurther, the polymer layer 34 according to the present embodiment mayhave high transmittance of 88% or more, thermal resistance of 100° ormore, and a coefficient of thermal expansion of 80 e-6/K or less.Thereby, bending of the polymer layer 34 does not occur in a hightemperature and high humidity environment or a thermal impactenvironment (e.g., within 100°) and the polymer layer 34 is preventedfrom being damaged. In other words, the polymer layer 34 may be made ofa material having a small thermal expansion coefficient and havingthermal stability. For example, the polymer layer 34 may be formed withpolyimide (PI), (poly) norbornene, high heat resisting polyester (PET),epoxy, and urethane Alternatively, the polymer layer 34 may be formedwith a copolymer. For example, the polymer layer 34 may be formed with acopolymer in which polymethyl methacrylate (PMMA) and special PMMA arecoupled, a copolymer in which polycarbonate (PC) and PI are coupled, acopolymer in which PMMA and PI are coupled, or a copolymer to whichurethane is coupled.

The adhesive layer 35 may be made of an adhesive material disposedbetween the polymer layer 34 and the glass layer 36. The adhesive layer35 can protect the glass layer 36 from an external impact. For example,as shown in FIG. 3, when a partial impact (e.g., pressing or stabbing ofa screen by a pen) 37 occurs in the outer layer 30, the adhesive layer35 may absorb at least a portion of the external impact to minimize theimpact from being transferred to the glass layer 36.

The adhesive layer 35 may be formed with an optical clear adhesive(OCA), an optical clear resin (OCR), or a film in which the OCA and theOCR are mixed. The OCA may have light transmittance of 90% or more andhave a thickness between 0.01 to 0.1 T. The OCA may generally have aYoung's Modulus between 10 to 250 KPa. In this case, when using an OCAhaving a high Young's Modulus, the glass layer 36 may be protected froma strong impact, but a bending property may be deteriorated. Forexample, when folding and unfolding operations are repeated severalhundred times to several thousand times, the OCA having a high Young'sModulus may be split. Accordingly, the adhesive layer 35 according tothe present embodiment may be formed with an OCA having a Young'smodulus between 10 to 100 KPa. Thereby, according to the presentembodiment, the adhesive layer 35 can prevent the glass layer 36 frombeing damaged by an external impact and improve a folding life-span.

The OCR may have light transmittance of 90% or more and have a thicknessbetween 0.02 to 0.05 T. The OCR may have a Young's Modulus between 10 to100 KPa.

A film (e.g., AB film) in which the OCA and the OCR are mixed may beformed by simultaneously implementing the OCA and a pressure sensitiveadhesive (PSA) at both surfaces of a film of a thin plate such as PET.When using a film in which the OCA and the OCR are mixed, reassembly anddurability can be simultaneously enhanced. According to an embodiment,the adhesive layer 35 may include at least one of the opticallytransparent OCA, OCR, and film in which the OCA and the OCR are mixed.

The glass layer 36 is thin plate glass. For example, the glass layer 36may have a thickness between 0.025 to 0.2 T. The glass layer 36 mayinclude a first portion in the first rigid portion 11 and a secondportion in the flexible portion 13. The first portion of the glass layer36 may have substantially almost the same thickness as that of a secondportion of the glass layer 36. Further, the glass layer 36 furtherincludes a third portion in the second rigid portion 12, and the thirdportion of the glass layer 36 may have substantially almost the samethickness as that of the second portion of the glass layer 36.

The glass layer 36 may be produced with a slimming construction methodof chemically (etching) cutting thick glass, a fusion constructionmethod of a surface non-contact method of forming a glass substrate bydropping and cooling a glass solution in the air, and a rollerconstruction method of flowing and extruding a glass solution betweentwo rollers. Further, the glass layer 36 may be produced with variousknown methods.

The glass layer 36 according to the present embodiment may have aYoung's modulus of 50 MPa or more. Thereby, by reinforcing bendingstrength of the polymer layer 34, the glass layer 36 according to thepresent embodiment may maintain surface hardness by resisting tostabbing or pressing when partial stabbing or pressing occurs, and whena user touches the glass layer 36, the glass layer 36 can improvesensory sensitivity.

Here, the polymer layer 34, the adhesive layer 35, and the glass layer36 may be coupled through a lamination process. The lamination processmay include a first process of laminating a film or liquid type adhesive(e.g., OCA, OCR) at one surface (e.g., a rear surface) of the polymerlayer 34; a second process of laminating the glass layer 36 at a filmgenerated through the first process; and a third process of autoclavingthe outer layer 30 generated through the second process. For example, inthe first process, the polymer layer 34 is attached in a guided state toa receiving jig through vacuum pressing, the adhesive layer 35 isattached to correspond to a guide to a moving jig attached to an upperplate or a moving shaft of the receiving jig, and by performing avertical or rotation movement of the moving jig, the polymer layer 34and the adhesive layer 35 may be coupled (laminated). In the secondprocess, the glass layer 36 is attached in a guided state to thereceiving jig through vacuum pressing, a film (the polymer layer 34+theadhesive layer 35) generated through the first process is attached tocorrespond to the guide to a moving jig attached to an upper plate or amoving shaft, and by performing a vertical or rotation movement, thepolymer layer 34, the adhesive layer 35, and the glass layer 36 may becoupled (laminated). The third process is a process of storing thegenerated outer layer 30 at a chamber of a high temperature and highpressure for a predetermined time or more. Bubbles existing between eachlayer may be removed through the third process, and adhesive strengthcan be enhanced.

According to an embodiment, in the outer layer 30, at least one of theanti-fingerprint layer 31, the anti-scratch layer 32, and theanti-reflective layer 33 may be omitted. Further, stacking order of theanti-fingerprint layer 31, the anti-scratch layer 32, and theanti-reflective layer 33 may be changed. Further, the outer layer 30 mayfurther include at least one functional layer such as a foggingprevention layer.

FIG. 4A is a diagram illustrating a coupling structure of a window in anelectronic device according to the related art, and FIG. 4B is a diagramillustrating an example of a coupling structure of an outer layeraccording to an embodiment of the present disclosure.

Referring to FIG. 4A, in an electronic device of the related art, awindow 43 that covers a display 42 may be bonded to a portion of ahousing 41. In other words, in an electronic device of the related art,a portion of the window 43 may be received in the housing 10. In theelectronic device of the related art, when an impact 44 is applied onthe window 43 received in the housing 41, the window 43 may be easilybroken. This is because the housing 41 that supports the window 43 is ahard material not to distribute or absorb an impact 44 and thus anentire impact is applied to the window 43.

Referring to FIG. 4B, in the electronic device 100 according to thepresent embodiment, the outer layer 30 and the housing 10 are notoverlapped. The outer layer 30 is not received in the housing 10.Thereby, an impact 46 applied to the outer layer 30 may be mitigated(distributed or absorbed) by a flexible display device 20 having lowerstrength than that of the housing 10. Thereby, in the presentembodiment, the outer layer 30 can be prevented from being damaged bythe external impact 46.

By minimizing a tolerance 45 between the display device 20 and thehousing 10, for example by minimizing a portion of the outer layer 30that is not supported by the display device 20, damage of the outerlayer 30 can be prevented or minimized. This is because when a portionthat is not supported by the display device 20 is pressed, the outerlayer 30 may be moved and damaged in an impact direction. For example,the tolerance 45 may be 0.25 mm or less.

FIG. 5 is a diagram illustrating another example of a coupling structureof an outer layer according to an embodiment of the present disclosure.

Referring to FIG. 5, an electronic device according to the presentembodiment may have a structure similar to that of FIG. 4B. At a rearsurface of a portion of the outer layer 30 that is not supported by thedisplay device 20, a support 55 for supporting the outer layer 30 may beadded. For example, in the present embodiment, by injecting a resin oran ultraviolet-curable resin into a rear surface of a portion of theouter layer 30 that is not supported by the display device 20, thesupport 55 may be added.

FIG. 6 is a cross-sectional view illustrating an internal structure ofan electronic device when being bent according to an embodiment of thepresent disclosure.

Referring to FIG. 6, when an electronic device according to variousembodiments of the present disclosure is bent, a bracket 50 to which thedisplay device 20 is attached may operate as a neutral plane in which alength does not increase or decrease. In the display device 20 and theouter layer 30 disposed at an upper portion of the bracket 50, a tensilestress that increases a length is applied. In this case, because theglass layer 36 is a rigid body, compared with the display device 20 andthe polymer layer 34, a tensile stress is not applied to the glass layer36, and at an interface between the glass layer 36 and the displaydevice 20 and an interface between the glass layer 36 and the polymerlayer 34, slip may be applied. Therefore, an adhesive layer 22 locatedbetween the glass layer 36 and the display device 20 and the adhesivelayer 35 located between the glass layer 36 and the polymer layer 34should be made of a material that may slip. Similarly, slip may occurbetween the bracket 50 and the display device 20. Therefore, an adhesivematerial (e.g., a double-sided adhesive tape 21) disposed between thebracket 50 and the display device 20 may be also made of a material thatmay slip.

In the foregoing embodiment of the present disclosure, life-spandeterioration of the outer layer 30 by slip occurring when an electronicdevice is folded can be solved.

FIG. 7 is a diagram illustrating a structure of an adhesive layer of anelectronic device according to an embodiment of the present disclosure.

Referring to FIG. 7, in an electronic device according to variousembodiments of the present disclosure, the adhesive layer 35 is dividedinto at least two portions, and each portion may have different adhesivestrength. For example, as shown in FIG. 7, the adhesive layer 35 mayinclude a first adhesive layer 35 a, second adhesive layer 35 b, andthird adhesive layer 35 c. The first adhesive layer 35 a may be locatedto correspond to the first rigid portion 11, the second adhesive layer35 b may be located to correspond to the flexible portion 13, and thethird adhesive layer 35 c may be located to correspond to the secondrigid portion 12.

The first adhesive layer 35 a and the third adhesive layer 35 c may havea Young's Modulus of 200 KPa or more, and the second adhesive layer 35 bmay have a Young's Modulus between 10 to 100 KPa. Therefore, accordingto the present embodiment, in order to improve surface strength, thefirst adhesive layer 35 a and the third adhesive layer 35 c of a portionthat is not bent have a high Young's Modulus, and in order to improve abending property, the second adhesive layer 35 b of a bent portion mayhave a relatively low Young's Modulus. Thereby, in the presentembodiment, while securing a bending life-span of a folded portion(e.g., the second adhesive layer 35 b), an impact property of a portion(e.g., the first adhesive layer 35 a and the third adhesive layer 35 c)that is not folded can be improved.

FIG. 8 is a block diagram showing a configuration of an electronicdevice according to various embodiments of the present disclosure. Theelectronic device 800 may include one or more processors 810 (e.g.,APs), a communication module 820, a subscriber identification module(SIM) 828, a memory 830, a sensor module 840, an input device 850, adisplay 860, an interface 870, an audio module 880, a camera module 891,a power management module 895, a battery 896, an indicator 897, and amotor 898.

Referring to FIG. 8, the processor 810 is capable of driving, forexample, an operating system or an application program to control aplurality of hardware or software components connected to the processor810, processing various data, and performing operations. The processor810 may be implemented as, for example, a system on chip (SoC). Theprocessor 810 may further include a graphics processing unit (GPU)and/or an image signal processor (ISP). The processor 810 is capable ofloading commands or data received from at least one of other components(e.g., a non-volatile memory) on a volatile memory, processing theloaded commands or data. The processor 810 is capable of storing variousdata in a non-volatile memory.

The communication module 820 is capable of including a cellular module821, a WiFi module 822, a Bluetooth (BT) module 823, a global navigationsatellite system (GNSS) module 824 (e.g., a GPS module, Glonass module,Beidou module or Galileo module), a near field communication (NFC)module 825, an MST module 826, and a radio frequency (RF) module 827.

The cellular module 821 is capable of providing a voice call, a videocall, an SMS service, an Internet service, etc., through a communicationnetwork, for example. According to an embodiment, the cellular module821 is capable of identifying and authenticating an electronic device ina communication network by using a SIM 828 (e.g., a SIM card). Accordingto an embodiment, the cellular module 821 is capable of performing atleast part of the functions provided by the processor 810. According toan embodiment, the cellular module 821 is also capable of including acommunication processor (CP).

Each of the WiFi module 822, the BT module 823, the GNSS module 824, andthe NFC module 825 is capable of including a processor for processingdata transmitted or received through the corresponding module. Accordingto various embodiments, at least part of the cellular module 821, WiFimodule 822, BT module 823, GNSS module 824, and NFC module 825 (e.g.,two or more modules) may be included in one integrated chip (IC) or oneIC package.

The RF module 827 is capable of transmission/reception of communicationsignals, e.g., RF signals. The RF module 827 is capable of including atransceiver, a power amp module (PAM), a frequency filter, a low noiseamplifier (LNA), an antenna, etc. According to another embodiment, atleast one of the following modules: cellular module 821, WiFi module822, BT module 823, GNSS module 824, and NFC module 825 is capable oftransmission/reception of RF signals through a separate RF module.

The SIM 828 is capable of including a card including a SIM and/or anembodied SIM. The SIM 828 is also capable of containing uniqueidentification information, e.g., integrated circuit card identifier(ICCID), or subscriber information, e.g., international mobilesubscriber identity (IMSI).

The memory 830 is capable of including a built-in memory 832 or anexternal memory 834. The built-in memory 832 is capable of including atleast one of the following: a volatile memory, e.g., a dynamic randomaccess memory (DRAM), a static RAM (SRAM), a synchronous dynamic RAM(SDRAM), etc.; and a non-volatile memory, e.g., a one-time programmableread only memory (OTPROM), a programmable ROM (PROM), an erasable andprogrammable ROM (EPROM), an electrically erasable and programmable ROM(EEPROM), a mask ROM, a flash ROM, a flash memory (e.g., a NAND flashmemory, an NOR flash memory, etc.), a hard drive, a solid state drive(SSD), etc.

The external memory 834 is also capable of including a flash drive,e.g., a compact flash (CF), a secure digital (SD), a micro-SD, amini-SD, an extreme digital (xD), a multi-media card (MMC), a memorystick, etc. The external memory 834 is capable of being connected to theelectronic device, functionally and/or physically, through variousinterfaces.

The sensor module 840 is capable of measuring/detecting a physicalquantity or an operation state of the electronic device, and convertingthe measured or detected information into an electronic signal. Thesensor module 840 is capable of including at least one of the following:a gesture sensor 840A, a gyro sensor 840B, a barometer (atmosphericpressure) sensor 840C, a magnetic sensor 840D, an acceleration sensor840E, a grip sensor 840F, a proximity sensor 840G, an RGB (color) sensor840H (e.g., a red, green and blue (RGB) sensor), a biometric sensor840I, a temperature/humidity sensor 840J, an illuminance sensor 840K,and a ultraviolet (UV) sensor 840M. Additionally or alternatively, thesensor module 840 is capable of further including an E-nose sensor, anelectromyography (EMG) sensor, an electroencephalogram (EEG) sensor, anelectrocardiogram (ECG) sensor, an infrared (IR) sensor, an iris sensorand/or a fingerprint sensor. The sensor module 840 is capable of furtherincluding a control circuit for controlling one or more sensors includedtherein. In various embodiments, the electronic device 800 is capable ofincluding a processor, configured as part of the processor 810 or aseparate component, for controlling the sensor module 840. In this case,while the processor 810 is operating in sleep mode, the processor iscapable of controlling the sensor module 840.

The input device 850 is capable of including a touch panel 852, a(digital) pen sensor 854, a key 856, or an ultrasonic input unit 858.The touch panel 852 may be implemented with at least one of thefollowing: a capacitive touch system, a resistive touch system, aninfrared touch system, and an ultrasonic touch system. The touch panel852 may further include a control circuit. The touch panel 852 may alsofurther include a tactile layer to provide a tactile response to theuser.

The (digital) pen sensor 854 may be implemented with a part of the touchpanel or with a separate recognition sheet. The key 856 may include aphysical button, an optical key, or a keypad. The ultrasonic input unit858 is capable of detecting ultrasonic waves, created in an input tool,through a microphone 888, and identifying data corresponding to thedetected ultrasonic waves.

The display 860 is capable of including a panel 862, a hologram unit864, or a projector 866. The panel 862 may be implemented to beflexible, transparent, or wearable. The panel 862 may also beincorporated into one module together with the touch panel 852. Thehologram unit 864 is capable of showing a stereoscopic image in the airby using light interference. The projector 866 is capable of displayingan image by projecting light onto a screen. The screen may be locatedinside or outside of the electronic device 800. According to anembodiment, the display 860 may further include a control circuit forcontrolling the panel 862, the hologram unit 864, or the projector 866.

The interface 870 is capable of including a high-definition multimediainterface (HDMI) 872, a universal serial bus (USB) 874, an opticalinterface 876, or a D-subminiature (D-sub) 878. Additionally oralternatively, the interface 870 is capable of including a mobilehigh-definition link (MHL) interface, a SD card/MMC interface, or aninfrared data association (IrDA) standard interface.

The audio module 880 is capable of providing bidirectional conversionbetween a sound and an electronic signal. The audio module 280 iscapable of processing sound information input or output through aspeaker 882, a receiver 884, earphones 886, microphone 888, etc.

The camera module 891 refers to a device capable of taking both stilland moving images. According to an embodiment, the camera module 891 iscapable of including one or more image sensors (e.g., a front imagesensor or a rear image sensor), a lens, an ISP, a flash (e.g., a lightemitting diode (LED) or xenon lamp), etc.

The power management module 895 is capable of managing power of theelectronic device 801. According to an embodiment, the power managementmodule 895 is capable of including a power management integrated circuit(PMIC), a charger IC, or a battery or fuel gauge. The PMIC may employwired charging and/or wireless charging methods. Examples of thewireless charging method are magnetic resonance charging, magneticinduction charging, and electromagnetic charging. To this end, the PIMCmay further include an additional circuit for wireless charging, such asa coil loop, a resonance circuit, a rectifier, etc. The battery gauge iscapable of measuring the residual capacity, charge in voltage, current,or temperature of the battery 896. The battery 896 takes the form ofeither a rechargeable battery or a solar battery.

The indicator 897 is capable of displaying a specific status of theelectronic device 800 or a part thereof (e.g., the processor 810), e.g.,a boot-up status, a message status, a charging status, etc. The motor898 is capable of converting an electrical signal into mechanicalvibrations, such as, a vibration effect, a haptic effect, etc. Althoughnot shown, the electronic device 800 is capable of further including aprocessing unit (e.g., GPU) for supporting a mobile TV. The processingunit for supporting a mobile TV is capable of processing media datapursuant to standards, e.g., digital multimedia broadcasting (DMB),digital video broadcasting (DVB), or mediaFlo™, etc.

The term “module” as used herein may be defined as, for example, a unitincluding one of hardware, software, and firmware or two or morecombinations thereof The term “module” may be interchangeably used with,for example, the terms “unit”, “logic”, “logical block”, “component”, or“circuit”, and the like. The “module” may be a minimum unit of anintegrated component or a part thereof The “module” may be a minimumunit performing one or more functions or a part thereof The “module” maybe mechanically or electronically implemented. For example, the “module”may include at least one of an application-specific integrated circuit(ASIC) chip, field-programmable gate arrays (FPGAs), or aprogrammable-logic device, which is well known or will be developed inthe future, for performing certain operations.

While the present disclosure has been shown and described with referenceto various embodiments thereof, it will be understood by those skilledin the art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the present disclosure asdefined by the appended claims and their equivalents.

What is claimed is:
 1. An electronic device comprising: a housingcomprising a first rigid portion, a second rigid portion, and a flexibleportion; an outer layer that covers the first rigid portion, the secondrigid portion, and the flexible portion; a display device including ascreen that comprises a first screen portion exposed through the firstrigid portion and a second screen portion exposed through the flexibleportion, the second screen portion extending from the first screenportion; at least one processor electrically coupled to the displaydevice; and a memory electrically coupled to the at least one processor,wherein the outer layer comprises: a polymer layer; a glass layerinterposed between the polymer layer and the screen; and an adhesivelayer interposed between the polymer layer and the glass layer, whereinthe outer layer continuously covers the first rigid portion, the secondrigid portion, and the flexible portion.
 2. The device of claim 1,wherein the second rigid portion extends from the flexible portion, andwherein the flexible portion is bendable such that the first rigidportion and the second rigid portion face each other when the flexibleportion is fully bent.
 3. The device of claim 2, wherein the screenfurther comprises a third screen portion exposed through the secondrigid portion, wherein the third screen portion extends from the secondscreen portion.
 4. The device of claim 3, wherein the third screenportion faces toward the first screen portion when the flexible portionis fully bent.
 5. The device of claim 3, wherein the third screenportion faces away from the first screen portion when the flexibleportion is fully bent.
 6. The device of claim 1, wherein the outer layerfurther comprises an anti-reflective layer.
 7. The device of claim 1,wherein the outer layer further comprises an anti-scratch layer.
 8. Thedevice of claim 1, wherein the outer layer further comprises ananti-fingerprint layer.
 9. The device of claim 1, wherein the polymerlayer comprises at least one of polyimide, norbornene, high heatresisting polyester, epoxy, urethane, a copolymer in which polymethylmethacrylate (PMMA) and special PMMA are coupled, a copolymer in whichpolycarbonate (PC) and PI are coupled, a copolymer in which PMMA and PIare coupled, or a copolymer to which urethane is coupled.
 10. The deviceof claim 1, wherein the glass layer has a thickness in a range between0.025 millimeters (mm) to 0.2 mm.
 11. The device of claim 1, wherein theadhesive layer comprises at least one of an optically clear adhesive oran optical clear resin.
 12. The device of claim 1, wherein the screenfurther comprises a touch screen.
 13. The device of claim 1, furthercomprising at least one capacitive element or a sensing circuitconfigured to detect a pressure against the screen, using the at leastone capacitive element.
 14. The device of claim 1, wherein the glasslayer comprises a first glass layer portion in the first rigid portionand a second glass layer portion in the flexible portion, and whereinthe first glass layer portion has substantially the same thickness asthe second glass layer portion.
 15. An electronic device comprising: ahousing comprising: a first rigid portion, a second rigid portion, and abendable portion connected between the first rigid portion and thesecond rigid portion, the bendable portion being configured to bebendable such that the first rigid portion and the second rigid portionat least partially face each other when the bendable portion is fullybent; an outer layer that covers the first rigid portion, the secondrigid portion, and the bendable portion; a display device including atouch screen that comprises: a first screen portion exposed through thefirst rigid portion, a second screen portion exposed through the secondrigid portion, and a third screen portion exposed through the bendableportion, the first screen portion extending from one side of the thirdscreen portion and the second screen portion extending from an otherside of the third screen portion; at least one processor electricallycoupled to the display device; and a memory electrically coupled to theat least one processor, wherein the outer layer comprises: a polymerlayer; and a glass layer interposed between the polymer layer and thescreen, across the first screen portion, the second screen portion, andthe third screen portion, and wherein the outer layer continuouslycovers the first rigid portion, the second rigid portion, and thebendable portion.
 16. The device of claim 15, wherein the glass layerhas a thickness in a range between 0.025 millimeters (mm) to 0.2 mm. 17.The device of claim 15, wherein the polymer layer comprises at least oneof polyimide, norbornene, high heat resisting polyester, epoxy,urethane, a copolymer in which polymethyl methacrylate (PMMA) andspecial PMMA are coupled, a copolymer in which polycarbonate (PC) and PIare coupled, a copolymer in which PMMA and PI are coupled, or acopolymer to which urethane is coupled.
 18. The device of claim 15,wherein the outer layer further comprises an adhesive layer interposedbetween the polymer layer and the glass layer, and wherein the adhesivelayer is substantially transparent.
 19. The device of claim 15, whereinthe memory is configured to store an application program comprising auser interface, and instructions that, when executed, cause the at leastone processor to display the user interface across the first screenportion, the second screen portion, and the third screen portion. 20.The device of claim 19, wherein the application program furthercomprises at least one of a web browser, a media play application, or aphoto gallery application.